Semiconductor ceramic package manufacturing service
We have many years of manufacturing technology and know-how for HTCC multilayer ceramic packages!
We provide high-reliability ceramic packages customized for various applications, from standard packages for device evaluation to those tailored to customer requests. We can accommodate everything from single-layer ceramics to multilayer ceramics. Our packages are suitable for industrial equipment, communication equipment, MPUs, ASICs, high-frequency devices, and device evaluation. Please feel free to contact us with your requests. 【Our Strengths】 ■ 3D structure capability ■ Compatible with various soldering of metal fittings ■ Supports a wide range of plating, including electrolytic and electroless plating ■ Abundant standard tools available ■ Can deliver from small quantities, etc. *For more details, please download the PDF or feel free to contact us.
- Company：NTKセラミック
- Price：Other
